High-Precision Flip-Chip Bonder_Hefei Sineva Intelligent Machine Co.,Ltd.

Main Products >High-Speed & High-Precision Equipment >Die Bonding Equipment

High-Precision Flip-Chip Bonder

Applied to high-end chips such as CPU, GPU,FPGA Flip Chip packaging processes. Mainly used for packaging processes such as FC-BGA, FC-CSP, and FC-Memory.

Product features

– Accuracy: ±5μm@3σ.

– UPH: 10,000.

– Dual-drive gantry system.

– Dual-Soldering Head Placement Structure for Enhanced Placement Efficiency.

– Double upward Vision inspection system for improved die bonding accuracy.

– Thermal compensation system, improve the stability of continuous production of equipment.

– Multi-material compatible and handling capability.

Core Technology

– High-speed and high-precision dual-drive gantry system.

– High-speed and high-precision motion control technology.

– Vibration suppression and control technology.

– Lightweight, high-rigidity structural design.

– Sub-micron high-precision visual recognition system.

– High-speed and high-precision structural design.

– Multi-axis motion control technology.