Back to list
Applied to high-end chips such as CPU, GPU,FPGA Flip Chip packaging processes. Mainly used for packaging processes such as FC-BGA, FC-CSP, and FC-Memory.
Product features
– UPH: 50,000.
– Accuracy: ±10μm@3σ, ±0.5°@3σ.
– Substrate Size: Max 860 *1500mm.
– 8 inch and 12 inch wafers.
– Chip Size: 0.075×0.15mm-3×3mm.
– Postbond detection.
Core Technology
– High-speed and high-precision motion control technology.
– Vibration control and suppression technology.
– Lightweight, high-rigidity structural design.
– High-speed and high-precision structural design.
– Multi-axis motion control technology.
Add me on Wechat
- About Us
- Company Profile
- Development History
- Company Honor
- Technology Advantage
- Sustainable development
- Main Products
- Vacuum Deposition Equipment
- Clean Transfer Equipment
- High-Speed & High-Precision Equipment
- Contact us
-
Telephone：0551-68122312
Sales Email：sales@sineva.com.cn
HR Email：hfzp@sineva.com.cn
Address：
Between Southwest of Longzihu Rd and Jingshan Rd, Xinzhan Zone, Hefei, Anhui, 230012, China
Block 10JDB Tech Park No.18 Kechuang 10th Street BDA Beijing 100176, China
Copyright © Hefei Sineva Intelligent Machine Co.,Ltd Disclaimer Anhui ICP No.14018951 Business License
Technical Support：IBWCopyright © Hefei Sineva Intelligent Machine Co.,Ltd
Disclaimer Anhui ICP No.14018951
Business License