Product features

– Machinable 2-12 inch LED, Si, SIC wafers

– High repetitive positioning accuracy,cutting accuracy are micron level

– Multi-focus cutting technology,sapphire oblique crack angle minimum

– Vertical unique optical path design,cutting electrical yield high

– Using coaxial laser focusing, focusing speed

– Automated unattended production, one person can manage 12 equipments

Core Technology

– Adopting self-made optical path system

– Single dual, multi focus cutting

– Sapphire oblique crack suppression technology